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  1. Materials for Information Technology Materials for Information Technology

    Materials for Information Technology

    Ehrenfried Zschech
    Springer London
    22.10.2010

    The fast-developing information technology industry is driving a need for new materials in order ...

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    213,99 €
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  2. Bondkontakte Bondkontakte

    Bondkontakte

    Ehrenfried Zschech
    De Gruyter, De Gruyter
    14.01.1991

    Keine ausführliche Beschreibung für 'Bondkontakte' verfügbar.

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    109,95 €
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  3. Advanced Interconnects for ULSI Technology Advanced Interconnects for ULSI Technology

    Advanced Interconnects for ULSI Technology

    Mikhail Baklanov
    Wiley
    02.04.2012

    Finding new materials for copper low-k interconnects is critical to the continuing development of...

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    249,50 €
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  4. Stress-Induced Phenomena in Metallization Stress-Induced Phenomena in Metallization

    Stress-Induced Phenomena in Metallization

    Shinichi Ogawa
    Springer, Berlin

    The conference was on reliability related science in ULSI interconnect. Its main purpose was to d...

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    174,68 €
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  5. Stress-Induced Phenomena in Metallization Stress-Induced Phenomena in Metallization

    Stress-Induced Phenomena in Metallization

    Ehrenfried Zschech
    Springer, Berlin

    One current challenge to micro- and nanoelectronics is the understanding of stress-related phenom...

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    Unser bisheriger Preis:ORGPRICE: 153,50 €

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  6. Stress Management for 3D ICS Using Through Silicon Vias: Stress Management for 3D ICS Using Through Silicon Vias:

    Stress Management for 3D ICS Using Through Silicon Vias:

    Ehrenfried Zschech
    Springer, Berlin

    Scientist and engineers as well as graduate students in the fields of This conference will be of ...

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    Unser bisheriger Preis:ORGPRICE: 139,50 €

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  7. Stress-Induced Phenomena in Metallization: Tenth International Workshop on Stress-Induced Phenomena in Metallization Stress-Induced Phenomena in Metallization: Tenth International Workshop on Stress-Induced Phenomena in Metallization

    Stress-Induced Phenomena in Metallization: Tenth International Workshop on Stress-Induced Phenomena in Metallization

    Paul S. Ho
    Springer London
    01.06.2009

    Stress-induced voiding and electromigration have emerged to become key reliability problems for s...

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    Unser bisheriger Preis:ORGPRICE: 124,50 €

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  8. Materials for Information Technology Materials for Information Technology

    Materials for Information Technology

    Ehrenfried Zschech
    Springer London
    01.09.2005

    The fast-developing information technology industry is driving a need for new materials in order ...

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    Unser bisheriger Preis:ORGPRICE: 213,99 €

    Jetzt 143,50 €
    Besorgungstitel - wird vorgemerkt
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  9. Stress-Induced Phenomena in Metallization: Eighth International Workshop on Stress-Induced Phenomena in Metallization Stress-Induced Phenomena in Metallization: Eighth International Workshop on Stress-Induced Phenomena in Metallization

    Stress-Induced Phenomena in Metallization: Eighth International Workshop on Stress-Induced Phenomena in Metallization

    Ehrenfried Zschech
    Springer London
    01.02.2006

    These proceedings present current research on issues related to stress-induced phenomena in on-ch...

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    197,95 €
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